Benefits
-
Supports EMI/RFI shielding and grounding in suitable electronic applications.
-
Helps establish electrical continuity between the backing and the application substrate through its embossed construction.
-
Offers a solderable tin-plated copper surface for appropriate assembly requirements.
-
Helps resist discoloration and oxidation of the copper backing.
-
Suitable for precision converting, including slitting and die-cutting.
-
Can be used in equipment, components and shielded-room applications when validated against project requirements.
Technical Specifications
| Property | Typical specification |
|---|---|
| Product model | 3M 1345 |
| Backing material | Embossed tin-plated copper foil |
| Adhesive type | Non-conductive acrylic pressure-sensitive adhesive |
| Nominal backing thickness | 0.036 mm (1.4 mil) |
| Total tape thickness, excluding liner | 0.104 mm ± 0.013 mm |
| Minimum adhesion to steel | 3.3 N/cm |
| Minimum breaking strength | 25 N/cm |
| Maximum electrical resistance | 0.005 Ω/in² under the specified test method |
| Average shielding effectiveness | 66 dB over 300 kHz–2.5 GHz under the specified test method |
| Temperature range | -40°C to 130°C |
| Flame retardancy | UL 510A, according to manufacturer documentation |
| Standard roll length | 16.5 m (18 yd) |
| Release liner | Removable liner |
| Typical color | Matte tin |
| Shelf life | 5 years under specified storage conditions |
Technical note: Values above are based on 3M technical documentation and are typical or test-method-dependent values, not universal guarantees. Confirm the current TDS, exact product configuration and applicable approvals before using these figures for engineering specifications or purchasing.
Applications
-
EMI/RFI shielding for electronic equipment and components
-
Grounding and electrical bonding in suitable assemblies
-
Shielded-room seams and selected shielding structures
-
Electrical design, prototyping and troubleshooting
-
Shielding applications requiring solderable tin-plated copper foil
-
Precision die-cut shielding parts and custom tape components
Compatible Materials
Potential substrates and application surfaces should be evaluated according to the required electrical and mechanical performance. Applications may include:
-
Metal equipment enclosures
-
Conductive metal panels and shielding components
-
Selected electronic assemblies
-
Surfaces requiring a foil shielding layer and grounding contact
Important: Compatibility depends on substrate finish, cleanliness, surface geometry and the intended electrical contact path. Test the complete assembly before production use.
Industries
-
Electronics and electrical equipment
-
Telecommunications and networking
-
Electronic enclosure manufacturing
-
EMI/RFI shielding and grounding
-
Electrical engineering and laboratory prototyping
-
Industrial equipment manufacturing
Why Choose 3M 1345?
3M 1345 combines embossed tin-plated copper foil with a pressure-sensitive acrylic adhesive and a removable liner. Its distinguishing feature is the embossed construction, which is designed to establish electrical contact through the adhesive layer. This makes it a candidate for applications where shielding, grounding and precision converting are required in one tape construction.
For engineering use, selection should be based on shielding requirements, electrical contact resistance, substrate compatibility, temperature exposure and the relevant compliance requirements.
Yousan can evaluate suitable tape slitting and precision die-cutting requirements according to project drawings, dimensions and estimated quantities.
Installation Guide
-
Prepare the surface: Ensure the substrate is clean, dry and free from dust, oil and other contaminants.
-
Confirm the contact design: Check that the embossed tape construction can establish the required electrical contact with the intended substrate.
-
Cut to size: Use the appropriate cutting or die-cutting process for the required shape and dimensions.
-
Position the tape: Remove the release liner carefully and align the tape with the target area.
-
Apply pressure: Press the tape firmly and evenly to achieve good contact and bonding.
-
Verify performance: Check adhesion and electrical continuity in the finished assembly. For EMI applications, conduct shielding tests using the relevant method and frequency range.
Follow the manufacturer’s instructions and validate the complete assembly under actual operating conditions.
Storage
-
Store in the original packaging in a clean, dry and controlled environment.
-
Recommended storage conditions in the technical data sheet: approximately 10°C to 27°C and below 75% relative humidity.
-
Protect the tape from direct sunlight, excessive heat, moisture and contamination.
-
Use within the manufacturer’s stated shelf life when stored under the specified conditions.
FAQ
1. Is the adhesive on 3M 1345 electrically conductive?
The acrylic adhesive is specified as non-conductive. The embossed pattern is designed to penetrate the adhesive and establish electrical contact between the tin-plated copper backing and the application substrate.
2. What is 3M 1345 used for?
It is designed for EMI shielding, grounding and electrical contact applications in suitable equipment, components and shielded-room structures.
3. Can 3M 1345 be soldered?
The tin-plated copper foil backing supports solderability. Confirm the soldering process and temperature against the manufacturer’s instructions and the requirements of the finished assembly.
4. Is 3M 1345 suitable for die-cutting?
Yes. The removable release liner supports handling and die-cutting. Actual cutting accuracy and processing performance depend on the part design, tooling and process conditions.
5. What is the operating temperature range of 3M 1345?
The manufacturer’s technical documentation lists a range of approximately -40°C to 130°C. This should not be interpreted as a guarantee of identical adhesion or shielding performance at every temperature.
6. Does 3M 1345 have flame-retardant properties?
The technical data sheet specifies flame retardancy according to UL 510A. Confirm the exact approval and its applicability to the finished product or assembly.
7. What is the difference between 3M 1345 and ordinary copper foil tape?
3M 1345 uses embossed tin-plated copper foil. Its embossed pattern is designed to create electrical contact through the non-conductive adhesive layer. Ordinary copper foil tape may not provide the same contact mechanism or shielding performance.
8. Can 3M 1345 be used for every EMI shielding application?
No. Suitability depends on the shielding frequency range, enclosure design, grounding method, substrate and required electrical performance. Validate the finished assembly before production use.
Downloads
Available upon request:
- 3M 1345 Copper Foil Tape Technical Data Sheet (TDS)
- Safety Data Sheet (SDS)
- Product Brochure
- Die-Cutting Capability Guide
Please contact our sales team if you require the latest technical documentation.
