Benefits
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Helps reduce electromagnetic and radio-frequency interference when properly designed and installed.
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Supports grounding and static charge dissipation.
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Provides electrical contact between the application surface and copper foil backing.
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Can be converted into custom shapes and components through slitting and die-cutting.
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Offers a convenient pressure-sensitive bonding solution without requiring heat or solvent activation.
Technical Specifications
| Property | Typical value |
|---|---|
| Product type | Copper foil EMI shielding tape |
| Backing material | Dead-soft copper foil |
| Adhesive type | Electrically conductive acrylic PSA |
| Backing thickness | 0.036 mm (1.4 mil) |
| Total tape thickness | 0.066 ± 0.005 mm |
| Minimum adhesion to steel | 2.7 N/cm |
| Minimum breaking strength | 39 N/cm |
| Maximum electrical resistance through adhesive | 0.005 Ω/in² under specified test conditions |
| Average shielding effectiveness | 66 dB over 300 kHz–2.5 GHz, under the specified test method |
| Flame retardancy | UL-recognized per UL 510A, Category OARC2, File E17385 |
| Standard roll length | 16.5 m (18 yd) |
| Voltage rating | 600 V for dry applications, as stated by 3M |
Note: Values are based on 3M’s June 2021 technical data sheet and product information. Electrical resistance and shielding effectiveness depend on test conditions, substrate, installation quality, and frequency. Confirm the applicable regional TDS before specifying these values for a project.
Applications
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EMI/RFI shielding in electronic equipment and components
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Electrical grounding and bonding
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Static charge draining
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Seaming and shielding of shielded rooms or enclosures
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Cable wrapping and electronic assembly
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Electrical design, testing, prototyping, and troubleshooting
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Surface contact to non-solderable materials where conductive adhesive contact is required
Compatible Materials
Potential application surfaces include:
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Metal surfaces used in electrical bonding
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Electronic enclosure surfaces
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Shielding components and conductive assemblies
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Non-solderable surfaces requiring electrical contact through conductive adhesive
Compatibility and electrical performance should be evaluated on the actual substrate. Surface cleanliness, roughness, coatings, and contact pressure can affect the result.
Industries
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Electronics and electrical equipment
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Telecommunications
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Consumer electronics
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Industrial electronics
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Electrical testing and prototyping
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EMI/RFI shielding and enclosure manufacturing
Why Choose 3M 1181 Copper Foil Tape?
3M 1181 combines a copper foil backing with electrically conductive acrylic adhesive, making it suitable for applications where both shielding and electrical continuity are important. Its removable liner supports precision converting, including custom-width slitting and die-cut parts. For production use, select the tape based on electrical requirements, substrate conditions, environmental exposure, and applicable compliance documentation.
Yousan can assist with adhesive tape sourcing, custom slitting, and precision die-cutting based on your drawing, dimensions, and application requirements.
Installation Guide
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Prepare the surface: Ensure the bonding surface is clean, dry, and free of dust, oil, and other contaminants.
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Cut the tape: Select the required width or die-cut shape for the application.
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Remove the liner: Expose the conductive adhesive immediately before application.
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Apply evenly: Position the tape carefully and press firmly to establish intimate contact with the substrate.
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Inspect the bond: Check for wrinkles, trapped air, gaps, or loose edges.
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Verify electrical performance: Where required, test grounding continuity, contact resistance, and shielding performance under the intended operating conditions.
Follow the applicable 3M technical documentation and equipment-specific procedures.
Storage
Store the tape in its original packaging in a humidity-controlled environment at approximately 10–27°C, with relative humidity below 75%, as specified in the 3M data sheet. Protect it from direct sunlight, moisture, contamination, and excessive heat.
The 3M June 2021 data sheet specifies a shelf life of five years from the date of manufacture when stored under the stated conditions. Confirm the current product documentation for the supplied region and lot.
FAQ
1. What is 3M 1181 copper foil tape used for?
It is commonly used for EMI/RFI shielding, grounding, static charge draining, cable wrapping, and electrical contact applications.
2. Is the adhesive electrically conductive?
Yes. 3M 1181 uses electrically conductive acrylic pressure-sensitive adhesive designed to provide an electrical path between the substrate and copper foil backing.
3. Can 3M 1181 be soldered?
The copper foil backing is solderable. Confirm that the soldering process and assembly conditions are suitable for the specific application.
4. Is 3M 1181 suitable for die-cutting?
Yes. The removable release liner supports handling and die-cutting into custom shapes.
5. What is the total thickness of 3M 1181?
The June 2021 technical data sheet specifies a total thickness of 0.066 ± 0.005 mm, including the copper foil backing and adhesive but excluding the release liner.
6. What is its shielding effectiveness?
The June 2021 data sheet reports an average of 66 dB over 300 kHz–2.5 GHz under its specified test method. Actual performance depends on installation, substrate, contact quality, and signal frequency.
7. Is 3M 1181 suitable for outdoor use?
Suitability depends on moisture, corrosion exposure, temperature, and the design of the complete assembly. It should not be assumed suitable for every outdoor environment without testing.
8. Can 3M 1181 be supplied in custom widths or shapes?
3M lists standard and custom converting options. Availability depends on the supplier and configuration; custom slitting and die-cutting can be evaluated against project requirements.
Downloads
Available upon request:
- 3M 1181 Copper Foil Tape Technical Data Sheet (TDS)
- Safety Data Sheet (SDS)
- Product Brochure
- Die-Cutting Capability Guide
Please contact our sales team if you require the latest technical documentation.







