Benefits
High Temperature Performance
Tesa 8853 is engineered for applications exposed to elevated temperatures, including PCB assembly and reflow soldering processes. It can withstand temperatures up to 260°C during processing.
Ultra-Thin Bonding Solution
The 50 μm thickness helps save space in compact electronic devices where conventional tapes may be too thick.
Excellent Processing Stability
The tissue carrier improves handling, punching, and die-cutting performance compared with unsupported adhesive films.
Strong Adhesion After Heating
Maintains good adhesion and holding power after thermal exposure, supporting reliable electronic component assembly.
Clean Manufacturing
Excellent resistance to adhesive bleeding and good dimensional stability during precision converting.
Technical Specifications
| Property | Specification |
|---|---|
| Product Name | tesa 8853 Double Sided Tissue Tape |
| Tape Type | Double-Sided Tissue Adhesive Tape |
| Carrier | Ultra-thin Non-woven Tissue |
| Adhesive Type | Acrylic Adhesive |
| Color | Translucent |
| Total Thickness | 50 μm |
| Liner | Glassine Paper |
| Heat Resistance | Up to 260°C (process exposure) |
| Application Temperature | Electronic assembly applications |
| RoHS Compliance | Yes |
| Processing | Die-cutting / Laminating / Slitting |
Applications
Electronics Manufacturing
- FPC (Flexible Printed Circuit) fixation
- PCB component fixing
- Electronic module assembly
- Display component bonding
- Semiconductor-related assembly
Consumer Electronics
- Smartphone components
- Tablet components
- Wearable devices
- Small electronic modules
Industrial Applications
- Thin material lamination
- Foam and film bonding
- Precision component mounting
- High-temperature assembly processes
Compatible Materials
tesa 8853 is suitable for bonding:
| Material | Application |
|---|---|
| Polyimide (PI/Kapton) | FPC fixation |
| PET Film | Film bonding |
| PCB | Electronic assembly |
| Metal | Component mounting |
| Aluminum | Lightweight structures |
| Plastics | Housing components |
| Foam Materials | Cushioning parts |
| Glass | Display components |
Industries
- Consumer Electronics
- Semiconductor Manufacturing
- PCB Assembly
- Automotive Electronics
- Medical Electronics
- Display Manufacturing
- Precision Industrial Equipment
Why Choose tesa 8853?
- Designed specifically for high-temperature electronic applications
- Ultra-thin 50 μm construction
- Excellent resistance to reflow temperatures
- Strong adhesion to PI, PET, metal, and plastics
- Excellent die-cutting capability
- Low adhesive residue and good processing cleanliness
- Suitable for precision OEM manufacturing
Guangdong Yousan provides:
- Custom roll sizes
- Precision die-cut parts
- FPC adhesive solutions
- Multi-layer lamination
- OEM adhesive converting
Installation Guide
- Clean the bonding surface and remove dust, oil, and contaminants.
- Ensure substrate surfaces are dry.
- Apply tape evenly without stretching.
- Apply sufficient pressure for proper wet-out.
- Avoid contamination of adhesive surfaces.
- Verify performance under actual process temperature before mass production.
Storage
Recommended storage conditions:
- Temperature: 15–25°C
- Relative Humidity: 40–60% RH
- Keep in original packaging
- Avoid direct sunlight
- Protect from moisture and heat
- Store rolls horizontally
- Follow FIFO inventory management
FAQ
What is tesa 8853 used for?
tesa 8853 is mainly used for FPC fixation, electronic component assembly, and high-temperature bonding applications requiring thin double-sided tape.
Can tesa 8853 withstand reflow soldering?
Yes. It is designed for electronic manufacturing processes and can withstand temperatures up to 260°C during reflow processing.
What is the thickness of tesa 8853?
The total thickness is 50 μm, making it suitable for thin electronic designs.
Can it be die-cut?
Yes. The tissue carrier provides excellent punching and die-cutting performance for precision adhesive components.
What is the difference between tesa 8853 and 3M™ 9448A?
| Product | tesa 8853 | 3M™ 9448A |
|---|---|---|
| Thickness | 50 μm | 150 μm |
| Carrier | Ultra-thin tissue | Tissue |
| Main Application | High-temperature electronics | General industrial bonding |
| Heat Performance | Higher | Good |
| FPC Application | Excellent | Limited |
3M™ 9448A is a thicker tissue tape designed for general bonding, foam bonding, and lamination, while tesa 8853 focuses on thin, heat-resistant electronic applications.
Downloads
Available upon request:
- Tesa 8853 Technical Data Sheet (TDS)
- Safety Data Sheet (SDS)
- Product Brochure
- Precision Die-Cutting Capability Guide
Please contact our sales team if you require the latest technical documentation.
