Substrate-Free Thermal Conductive Tape

Substrate-free thermal conductive tape (Thermally Conductive Transfer Tape) is a highly conformable, pressure-sensitive adhesive tape engineered specifically for thermal management applications. Unlike traditional thermal tapes, it has no carrier or backing (substrate) layer, consisting entirely of a soft, thermally conductive adhesive. This design maximizes surface contact, reduces thermal resistance, and ensures efficient heat transfer between heat-generating components and heat sinks, while maintaining electrical insulation and strong adhesion.

Features:

• No substrate — fully adhesive, soft and conformable.

• Excellent thermal conductivity for efficient heat dissipation.

• Electrically insulating and thermally conductive.

• Fills microscopic surface irregularities to minimize thermal resistance.

• Easy to apply and rework.

Applications:

Bonding heat sinks, heat spreaders, or chassis to ICs, LEDs, and power devices, Thermal management in compact electronic assemblies, Battery modules, power supplies, and high-power circuits, Applications where low thermal resistance and high adhesion are critical.

Additional Documents:

Substrate-Free Thermal Conductive Tape (TDS)

Adhesive Tapes Selection Guide

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