Bergquist thermal pads are high-performance thermal interface materials designed to efficiently transfer heat from electronic components to heat sinks, housings, or chassis. Made with advanced silicone or non-silicone formulations, they offer excellent thermal conductivity, conformability, and electrical insulation. These pads fill microscopic air gaps to reduce thermal resistance, ensuring stable thermal performance in high-power and high-density electronics.
Features:
High Thermal Conductivity for superior heat dissipation in demanding applications.
Soft, Conformable Material that minimizes stress and fills uneven surfaces for optimal contact.
Excellent Electrical Insulation to protect sensitive components.
Low Compression Force for easy assembly and reduced component stress.
Reliable Long-Term Performance, even under thermal cycling and vibration.
Custom Thicknesses and Die-Cut Options for easy integration into device designs.
Applications:
Power modules and power supply units (PSUs), VRAM, SSD, LED lighting assemblies, Automotive electronics and control units, Battery packs and EV systems, Telecom and networking equipment, Consumer electronics and home appliances, Industrial control systems and automation devices, GPU, CPU, and semiconductor cooling.
The values given are typical values, and do not constitute a specification. We recommend testing the suitability of the self-adhesive tape for the designated application or use. Please contact usor e-mail info@ysdiecut.comto determine product availability.
Thermal Transfer Pads Manufacturer Yousan New Materials
Storage
It is recommended to store in a clean and dry place, away from direct sunlight to prevent damage to the packaging, and to avoid storing with volatile solvents. Store at 25±5°C and humidity at 50±5%.
