Phase Change Material for Thermal Management, Electronics Cooling & Heat Dissipation

Phase Change Material is a thermal interface material that remains solid at room temperature and softens or melts at a designed temperature, allowing it to flow and fill microscopic air gaps between heat sources and heat sinks for efficient heat transfer. At room temperature it remains solid for ease of handling, then automatically transitions phase under operating conditions to deliver significantly lower interface thermal resistance.

Features:

• Solid at room temperature for easy handling and assembly.
• Melts at operating temperature to reduce thermal interface resistance.
• Excellent surface wetting for improved heat dissipation.
• No pump-out or dry-out compared to thermal grease.
• Clean, non-greasy, and reworkable.
• Electrically insulating, thermal conductivity typically ranges from 2.0 ~ 10.0 W/m·K (customizable by formulation).
• Suitable for automated placement and die-cut processing.

Applications:

IC, CPU, MOS, LED, M/B, P/S, Heat Sink, LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc. DDR II Module, DVD Applications, Hand-set applications, etc.

Additional Documents:

Phase Change Material (TDS)

Adhesive Tapes Selection Guide

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