Ultra-Thin Polyimide Insulating Film

Ultra-thin polyimide insulation film (PI film) series is a high-performance thin-film insulation material, featuring high temperature resistance, excellent insulation, and extremely thin thickness. It is commonly used in precision electronic fields such as flexible printed circuits (FPC) and electromagnetic wires.

Features:

• Dielectric strength up 140 to 260 kV/mm, ideal for high-voltage insulation and flexible printed circuits (FPC).
• Available in thicknesses from 1μm to 2μm, providing superior flexibility and space-saving design for compact electronic devices.
• Minimal shrinkage and expansion across wide temperature ranges, ensuring precise performance in microelectronic applications.
• Resistant to most solvents, oils, and chemicals, ensuring durability and long-term performance.
• High tensile strength with excellent flexibility, suitable for bending, rolling, and lamination processes.
• Naturally flame-retardant and resistant to radiation, meeting UL94 V-0 standards.
• Available with single-side or double-side corona, plasma, or chemical treatments for enhanced adhesion to adhesives or coatings.

Applications:

Mainly used for high-temperature protection and insulation of electronic devices, as well as in flexible circuits, electromagnetic wires, and precision electronics. It is particularly outstanding in wearable devices, precision electronic components, and industrial control.

Additional Documents:

Ultra-Thin Polyimide Insulating Film（TDS）

Adhesive Tapes Selection Guide

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