Non-silicone Thermal Pad

Non-silicone Thermal Pad is a high-performance thermal interface material designed for applications where silicone contamination must be strictly avoided. It provides reliable heat transfer between heat-generating components and heat sinks while meeting stringent cleanliness and compatibility requirements. Made from non-silicone elastomeric materials with thermally conductive fillers, it ensures stable thermal conductivity, electrical insulation, and long-term reliability without silicone oil migration or outgassing. This thermal pad is ideal for sensitive electronics and optical systems that demand clean, residue-free performance under continuous thermal cycling and mechanical stress.

Features:

• Silicone-free formulation – eliminates risk of silicone contamination, oil bleed, and outgassing.
• 2.0 ~ 10.0W/m.K Stable thermal conductivity for efficient heat dissipation.
• Low thermal resistance ensures reliable heat transfer.
• Electrically insulating and safe for electronic components.
• Soft and compliant – conforms to uneven surfaces with low contact pressure.
• Excellent long-term reliability under thermal cycling and aging.
• Clean and residue-free – suitable for optical, medical, and precision devices.
• Easy to die-cut and process for custom shapes and sizes.

Applications:

Electronic components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, EnergyStorage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, PowerElectronics, Robot, Servers, Smart Home, Telecom, etc.

Additional Documents:

Non-silicone Thermal Pad (TDS)

Adhesive Tapes Selection Guide

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