Leading Die-Cut Solutions for the Electronics Industry
We provide high-performance die-cut tape solutions tailored for the electronics industry, supporting applications such as insulation, shielding, bonding, and thermal management. Typical applications include:
Bonding of Screen and Shell
Application: Screen fixation for mobile phones, tablets, watches, and other devices.
Features: Improve heat dissipation efficiency and extend electronic lifespan.
Structural Buffering and Shock Absorption
Application: Shock absorption and fixation between components such as batteries, sound chambers, and camera modules.
Tape type: Foam adhesive, EVA gaskets.
Features: Absorbs vibration, improves durability, and enhances user experience.
Label and Insulation Protection
Application: Battery pack, motherboard, cable fixation, and identification.
Tape type: PET tape, PI tape, and label tape.
Features: Good insulation, printable, and high temperature resistance.
Let us help you find tape solutions
Discover precision adhesive tape and die-cut solutions tailored for the electronics industry. These solutions support applications ranging from bonding and insulation to EMI shielding and thermal management.
Ultra-thin Double-Sided Tape
Touch screen, display, fingerprint module, camera bonding.
Foam Tape
Camera module shock absorption, earpiece dust-proof sealing, speaker fixation.